+86 731 8800 3666
All Categories


You are here : Home > BLOG

Technological Innovation And Challenges Faced By Diamond Wire

May 08,2023

For the photovoltaic industry, reducing costs and increasing efficiency is an eternal topic, especially in the past two years when silicon material prices have skyrocketed and devoured downstream profits. How to reduce cutting losses and reduce silicon wafer costs is an urgent issue for silicon wafer enterprises to solve.

1. The inevitable result of silicon wafer thinning is diamond wire thinning
Thinning of silicon wafers has been the direction of efforts in the silicon wafer industry to reduce single chip costs in the past two years. Accompanied by the thinning of silicon wafers is the thinning of diamond wires.

Advantages of Refined Lines
(1) Diamond wire refinement can reduce the loss of silicon during cutting. During the slicing process, the fragmentation rate of silicon wafers decreases, thereby improving the yield of silicon wafers. The high price of silicon material drives the reduction of diamond wire diameter, reducing silicon consumption, which is the most direct and effective benefit.
(2) Diamond wire refinement can cut thinner silicon wafers. Just like using an axe to cut vegetables and using a kitchen knife to cut vegetables. Both of these reasons help to cut silicon rods of the same length into a larger number of silicon wafers.
(3) After refining the diamond wire, the amount of busbar material used will be significantly reduced. Due to the smaller diameter and cross-sectional area of the wire, the mass of the busbar also decreases, indicating material savings.

Disadvantages of Refined Lines
(1) The thinner the wire, the more difficult it is to draw and process the busbar, such as nickel plating and diamond powder coating, which requires higher costs;
(2) The thinner the wire, the smaller the tension, and the lower the cutting speed and efficiency, which requires a time cost;
(3) The thinner the wire, the smaller the diameter, and the less diamond powder attached to the same length. Cutting the same silicon wafer requires longer diamond wires;
(4) The thinner the wire, the easier it is to break under the same material, and the slicing process involves multiple wires working together, resulting in a long wiring time after the wire is broken.

2. The busbar is facing the possibility of replacement
Diamond wire itself also faces the challenge of tungsten wire. Although steel wire has a lower cost compared to tungsten wire, the problem is that the breaking force is not as strong as tungsten wire, and the current 38-42 micrometers are close to the limit of steel wire. Tungsten wire substitution has become a new direction.
Comparing steel wire and tungsten wire diamond wire from the perspective of service life, tungsten wire diamond wire is used 10-20 times more frequently than steel wire. But the drawbacks are: firstly, the price of tungsten is higher than that of steel wire, and the price of tungsten wire of the same length is several times that of steel wire; Secondly, the maximum winding length of tungsten wire is 100km, while steel wire can reach 300km, so the cost of transportation and use is also higher than that of steel wire; Thirdly, the current production rate of tungsten wire busbar is lower than that of steel wire, which increases the cost of tungsten wire.
So, both diamond wire fine-tuning and busbar substitution have advantages and disadvantages, and a trade-off needs to be made.
From the perspective of historical development, the relatively low threshold for diamond wire has also led to intense competition among diamond wires for a period of time. At the moment, we believe that the technology and production of diamond wires are being comprehensively improved. The development of fine wire is accelerating, and at the same time, under the bottleneck of traditional high carbon steel wire fine wire, the busbar material faces the possibility of replacement. In addition to the continuous trend of large-sized and thinned silicon wafers, the technical barriers to diamond wire are expected to strengthen. In terms of production and manufacturing, leading enterprises have increased their efforts to transform one machine into multiple lines, significantly improving production efficiency.

Our products scope:
(1) Monocrylline
(2) RVD
(3) Micron-powder
(4) CBN
(5) CBN-micron-powder
(6) Coated-diamond

Related product details information:
(1) Mono-crystal Diamond:

(2)RVD Crushed diamond HFD1211:

(3)Crushed resin diamond micron powder HFD-MPBM:

(4)Black Color HFD-C05 diamond CBN powder with Good Friability and Self-Sharpen Ability:

(5) CBN(Cubic Boron Nitride) Micron Powder Abrasive HFD-CM1:

(6) Copper-coated Synthetic Diamond Powder:

Contact Us:
Changsha Hengfeng Superhard Materials Co., Ltd.
Add: No. 485 Tongzipo Road, Changsha, 410013, China.
TEL: +86 731 8800 3666;
Mail: [email protected]
Web: https://www.hfdiamondpowder.com/index.html

Table of Contents