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Technical Level And Characteristics Of The Diamond Wire Industry

June 14,2023

1. Current technical level and characteristics of the industry

Diamond wire, as a consumable for cutting hard and brittle materials, directly determines the quality and cost of slicing. Diamond wire needs to withstand high-frequency reciprocating motion and significant tension during the cutting process. The surface quality of the slice requires high diamond distribution density and consolidation strength, diamond cutting ability, and fatigue resistance of the steel wire. The production process mainly involves pre-treatment of diamond and embryo line – metal and diamond composite electroplating – shaping.

The pre-treatment of diamond mainly involves metallizing the surface of the diamond to prepare for the rapid electrodeposition of diamond through composite electroplating; The pre-treatment of the embryo line mainly involves cleaning and activating its surface through acid alkali water washing, preparing for metal electrodeposition. Composite electroplating generally consists of two stages: sand plating and thickening plating, with sand plating being the core step. Currently, the main methods of sand plating include sand dropping and sand embedding.

The sand drop method involves the embryo line passing through the sand tank at a certain speed, and the diamond powder in the tank is suspended in the plating solution through stirring. The diamond uses its own gravity to fall on the embryo line substrate to complete the sand loading; The sand embedding method involves burying the matrix of the embryonic line into the diamond powder stacked in the plating solution to complete the sanding process.

At present, technical research in the diamond wire industry mainly focuses on diamond metallization treatment, fine diameter high-strength steel wire, electroplating process, equipment and process control, which are reflected in indicators such as product diameter deviation, breaking force, diamond distribution density and uniformity. When downstream customers use diamond wire, they mainly have strict requirements for indicators such as cutting line speed, wire consumption, cutting tension, main cutting speed, cutting time, and chip yield. Therefore, the R&D and production technology processes in this industry are complex, involving multiple fields, and the process control is strict. Technical workers have high requirements for technical mastery in various production processes.

2. Technological Development Trends in the Industry

With the rapid development of new energy and electronic technology, the application of hard and brittle materials such as silicon crystals, sapphire, and zirconia ceramics is becoming increasingly widespread. The slicing of hard and brittle materials is gradually developing towards large-sized, thinned, and high-precision directions, and the requirements for diamond wire cutting quality, cutting speed, and cutting breaking force are constantly improving. The trend of diamond wire cutting towards fine line, solid solidification, reduced line consumption, and increased cutting speed is constantly developing.

The technological development trend of the diamond wire manufacturing industry is mainly reflected in the following aspects:

(1) The trend of diamond wire diameter thinning. Diamond wire cutting, due to the solidification of diamond particles on the surface of the steel wire, has the same movement speed as the steel wire during the cutting process. Diamond particles will not cause damage to the steel wire, and its cutting ability is significantly improved compared to traditional free cutting, which provides the possibility for fine wire cutting. Our company’s diamond wire production for silicon wafer cutting has reached 36-40 μ M specifications, while finer specification products are already under development.


(2) The configuration of diamond powder is becoming increasingly refined. The configuration of diamond powder is developing towards refinement, with the proportion of various diamond configurations, important parameter settings, feedback, and online adjustments continuously refined, thereby continuously improving the comprehensive performance of diamond powder.

(3) The diamond wire plating process is becoming increasingly stable and mature. The stability of the plating process is an important factor affecting the quality of diamond wires. Enterprises in the industry continuously improve the plating process by using chemical vapor deposition (CVD) surface metallization methods to improve the surface properties of diamonds, adding new additives, controlling current, voltage, wire speed, etc., making the plating process increasingly stable and mature.

(4)The diamond wire plating process is becoming increasingly environmentally friendly. Enterprises in the industry have gradually developed fully enclosed, internal circulation, and pollution-free diamond production lines, which have low energy consumption per unit output value and achieve continuous, efficient, stable, and environmentally friendly fully automated production.